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Developers' interview
01 Concept
Atsushi Miyairi
Developing a communication device loaded with several antennas. We achieved a flat device by shrinking the motherboard of the VAIO TX series by 30%
Increased reception and a sleek design are just two of the reasons for placing an antenna in the top right corner of the LCD display.
As a communication device we wrestled with introducing more real-world situations during development
The new VAIO TZ has a slim, compact design, but is in fact loaded with internal antennas. First, the wireless LAN, with both transmission and reception capabilities, accounts for three antennas. This was achieved through the support of MIMO (Multiple Input Multiple Output), which uses multiple antennas to enable transmission speeds in excess of 100Mbps. Of course Bluetooth is also included. When it comes to keeping you connected to the world, this is one device that comes fully loaded. Chief electrical design engineer Miyairi had this to say.

Miyairi: Having entered the age when it's necessary to load the mobile VAIO notebook with multiple antennas, from the designer's standpoint we can safely say that we have now entered the territory of communication devices. During the development of the new VAIO TZ we reassessed the introduction of equipment and developed under the strictest conditions to create a device with superior communication functionality. We also developed from scratch a new tool to reduce noise interference. We tackled the difficulties that arose in development by creating an environment supported by our painstaking preparations. We took nothing for granted and left nothing to chance.
Ventilation for the fan on the left side of the device. The Bluetooth antenna is behind the vent. This design protects the antenna from the effects of heat.
 
The 10cm X 10cm ultra high density motherboard loaded with the Core(TM)2 Duo processor
The functionality of PCs has increased by leaps and bounds over the past 10 years, but this has meant that the hardware has also become increasingly complex. The greatest dilemma facing designers is the fact that with increased functionality it stands to reason that overall size would also have to increase. The team developing the new VAIO TZ boldly endeavoured to create a flat body. What made this a reality was the state-of-the-art Core(TM)2 Duo processor, making the ultra high density motherboard 10cm X 10cm, which is roughly the same size as the VAIO UX. This is approximately 30% smaller than the previous model, the VAIO TX. Mr. Miyairi had this to say.

Miyairi: Up to now there was a limited amount of physical space to work with to improve functionality, such as layering the PC card slot directly on top of the motherboard, or rearranging other internal components. However, in order to make the new VAIO TZ flat and yet slimmer than ever before, we couldn't layer components. Instead we shrunk the motherboard by shrinking every possible part, and painstakingly removing anything that wasn't absolutely essential. For example, we were able to shrink the micro-computer for power management to 1/4 the size it used to be, and were able to align the condensers around the CPU in such a way that we only needed three to do the job. Because of the delicate nature of this undertaking, we worked closely with the vendors of these parts.

In order to shrink the architecture without incurring any loss in performance, it was imperative for the electrical design team, structural design team, heat flow and production teams to all convene in one place to develop the new VAIO. Before actually beginning development everyone gathered around a single CAD to run simulations and have discussions in a sort of "virtual production." I think the driving force behind the birth of the new VAIO TZ was this new style of development.
The body of the new VAIO TZ has been ordered and arranged in a very narrow space. A painstaking effort was made to shrink every part to achieve a flat device.
The "Motion Eye" camera is embedded in the LCD display. Only 4mm across, yet picture quality has been improved.
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